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B39162B8813P810

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Datasheets B39162B8813P810
 
EDA / CAD Models B39162B8813P810 by SnapEDA
 
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Product Attributes
TYPE DESCRIPTION SELECT ALL 
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Manufacturer Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Series *
Packaging Tape & Reel (TR) 
Part Status Active
Mounting Type Surface Mount
Package / Case 5-SMD, No Lead
Height (Max) 0.016" (0.40mm)
Size / Dimension 0.055" L x 0.043" W (1.40mm x 1.10mm)
 
Environmental & Export Classifications
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Additional Resources
Standard Package  5,000
Other Names 495-7022-2 
B8813 


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